For the embedded system market, AMD announced the launch of the new G-series APU member GX-210JA, emphasizing a minimum of 6W thermal power design (up to 25W) and a minimum of 3W of expected average thermal power performance, allowing partners to design Fanless applications such as tablet devices, automatic control systems, communications applications or small computer devices. Pans, Stainless Steel Fry Pan with Lid, China Pans Jiangmen Yuesheng Metal Products Co., Ltd. , https://www.hkbestgain.com
AMD previously announced the launch of new G-series APUs for embedded market applications. In addition to emphasizing maintenance of a minimum 6W-25W thermal power design, the GX-210JA has also introduced a 3W expected average thermal power performance. The hardware architecture also adopts the previous e-Kabini platform SoC design, mainly focusing on industrial control and automation, digital games, communication infrastructure core architecture, and visual embedded products, including the application market for thin computers, digital signage, and medical imaging. Includes fanless design products.
The newly added GX-210JA is compatible with 6W-25W thermal power design in low-power x86 compatible products, and supports enterprise-level error correction code memory technology, which corresponds to minus 40 degrees Celsius to 85 degrees Celsius. Environment, and provide dual-core or quad-core architecture design, as well as the integration of Radeon GPUs and I/O controllers.
The new G-series embedded SoC APUs, including the GX-210JA, have been shipped in succession, and are expected to be used in conjunction with embedded solution providers to establish a complete industrial ecosystem.